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?@???H??ł́A???Ђ̓Ǝ??Z?p?ł???V???R???_?C??3D?ϑw????uSoIC?iSystem on Integrated Chips?j?v?Z?p?̗ʎY?ɑΉ?????B???Ђ́A?u?t?????g?G???h?A?o?b?N?G???h?A?e?X?g?T?[?r?X?܂ł?3DFabric?????????????鏉?̍H?ꂾ?v?Ɛ????B???H??ɂ???āASoIC??InFO?iIntegrated Fan-Out?j?ACoWoS?iChip-on-Wafer-on-Substrate?j????ѐ?i?e?X?g?Ȃǂ?3DFabric??i?p?b?P?[?W???O????уV???R???ϑw?Z?p?ɏ_??ɐ??Y?\?͂????蓖?āA???Y?????܂?Ɛ??Y?????̌????????????Ƃ??Ă???B
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????́A?t?????g?G???h3D?ƃo?b?N?G???h3D????????鑼?ATSMC???uCSYS?iComplementary Systems, SoCs and Chiplets integration?A?V?[?V?X?j?v?ƌĂԃ\?????[?V???????Љ??B
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????A2021?N8???ɃI?????C???ŊJ?Â??ꂽ?uHot Chips?v?̋Z?p?u?????A?uTSMC packaging technologies for chiplets and 3D?i?`?b?v???b?g??3?????W?ςɌ?????TSMC?̃p?b?P?[?W???O?Z?p?j?v?̍u?????e???Љ??B
TSMC?̔?????2nm?܂ŁH ?ȍ~?̓p?b?P?[?W???O???̂?
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